Robotic Configuration:

• High-load robotic systems equipped with high-torque grinding heads for aluminium and copper fins
• Tool cooling systems to avoid thermal warping during prolonged grinding
• Custom clamping fixtures to secure finned or irregular heat sink structures

Process Integration:

• Flat-surface grinding to enhance CPU/GPU contact base uniformity
• Deburring of edge fins, hole interfaces, and extrusion marks
• Compatibility with post-grinding thermal paste or coating application

Key Benefits:

• Improves thermal transfer efficiency via enhanced surface flatness
• Reduces mechanical tolerance mismatch in thermal modules
• Scalable to handle various sink geometries and OEM profiles

Applications:

Laptop and desktop heat sinks, power supply radiators, LED cooling plates

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